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E Ink, the creator of ePaper technology, has partnered with several of its ecosystem partners to develop the next generation of electronic shelf label (ESL) technology.
E Ink, the creator of ePaper technology, has partnered with several of its ecosystem partners to develop the next generation of electronic shelf label (ESL) technology, according to a press release.
E Ink is collaborating with Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop System on a Panel architecture, in addition to working with system integrator SOLUM to develop ESL technology.
Priorities include decreased power usage, lower material usage, and increased sustainability.
The project includes Bluetooth System on Chip technology from Realtek, along with the use of integrated circuitry developed with IST and Chipbond that features the debut of Conical Granule Au bump (CGA bump) in the place of gold bumps in the packaging process.
“Replacing paper labels with ePaper shelf labels brings higher efficiency and lower energy consumption to retailers,” Johnson Lee, CEO at E Ink, said in the release. “Our commitment to advancing ePaper technology drives us to continue collaborations with our supply chain partners. We worked together to develop technology to realize the potential of SoP on ePaper panels and to drive the next generation electronic shelf label. The newly developed ePaper label solution will bring higher operational efficiency to retailers and contribute positively to carbon reduction efforts.”
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